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RuggON XR12 12" Military Panel PC


  • 12" 1024 x 768 Multi Touch with AG Film
  • 1000 nits Brightness with Night Vision Capability
  • Intel Coffee Lake R ™i7 9850HL Processor 6 core, up to 4.10 GHz
  • Mobile Intel® CM246 Chipset
  • 16GB DDR4 Memory Soldered Onboard, 32GB Option
  • 2 x M.2 2242 SATA MLC SSD
  • Removable Storage Tray for Easy Maintenance
  • Support MXM Interface to Enhance Graphic Capability
  • TPM2.0
  • 28 physical keys, Rubber with LED indicator, can be disable via SW
  • Withstand harsh environment and tested by MIL-STD-810G
  • EMC compliant with MIL-STD-461G, Power Design Compliant with 1275E

The XR12 is a military panel PC featuring a 12" 1000 nits LCD screen with multi-point AG touch screen. The screen also has a night vision mode. The XR12's design is mainly centered on vehicle applications as there is also an ignition sense with time delay built in to the power unit.

Functionality in harsh environments is also integrated into the design as the XR12 is capable of operating at an altitude of 20,000 feet and temperatures ranging from -40 degrees Celsius to 71 degrees Celsius. When not in operation, the unit may be stored at more severe temperatures between -46 degrees Celsius and 81 degrees Celsius. As panel PC designed for vehicles, shock endurance is accounted for as well as the XR12 can withstand up to 40G, 11ms.

The XR12 also comes equipped with an accessible tool-less removable storagetray. The I/O interface comes built with six USB 2.0 ports, 1 VGA port and 1 DVI-D port.

The internal system runs on the Intel i7-9850HL 1.9 Ghz processor and is installed with M.2 SSD's for storage in the sizes of 512 GB and 1 TB. In terms of memory it is equipped with 16GB of DDR4 RAM.

Base Configurations

RuggON XR12 12 inch Military Panel PC

  • 12" 1024 x 768 Multi Touch Screen with AG Film

  • 1000 nits High Brightness with Night Vision Capability
  • Intel Coffee Lake R ™i7 9850HL Processor 6 core, up to 4.10 GHz
  • 16GB DDR4-2400Mhz Soldered Onboard
  • 128GB M.2 Solid State Drives
  • MXM GPU Module (Optional)
  • 6x USB 2.0, 2x GbE, 4x RS-232, 2x RS-422/485, 1x VGA, 1x DVI-D, 8x DI, 8x DO, 2x CANbus
  • Operating Altitude: MIL-STD-810H 500.6 Procedure II, 20,000 ft
    Storage Altitude: MIL-STD-810H 500.6 Procedure I, 40,000 ft
  • Operating Temp. -40°F ~ 159.8°F (Method 502.6 Procedure II)
    Storage Temp. -50.8°F ~ 177.8°F (Method 502.6 Procedure I)
  • Shock: MIL-STD-810H Method 516.8 Procedure I 40G, 11ms (OP)
    MIL-STD-810H Method 516.8 Procedure V 75G, 6ms (Non-OP
  • 16-40 VDC Power Input, Compliance with MIL-STD-1275E